337936 Tang, K. F. (2003). Novel grinding process for failure analysis of IC Chip packaging. Skudai : Universiti Teknologi Malaysia.
Citación estilo Chicago337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.
Cita MLA337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.
Warning: These citations may not always be 100% accurate.