Cita APA

337936 Tang, K. F. (2003). Novel grinding process for failure analysis of IC Chip packaging. Skudai : Universiti Teknologi Malaysia.

Citación estilo Chicago

337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.

Cita MLA

337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.

Warning: These citations may not always be 100% accurate.