337936 Tang, K. F. (2003). Novel grinding process for failure analysis of IC Chip packaging. Skudai : Universiti Teknologi Malaysia.
Cita Chicago (17th ed.)337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.
Cita MLA (9th ed.)337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.
Atenció: Aquestes cites poden no estar 100% correctes.