APA ציטוט

337936 Tang, K. F. (2003). Novel grinding process for failure analysis of IC Chip packaging. Skudai : Universiti Teknologi Malaysia.

Chicago Style (17th ed.) Citation

337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.

ציטוט MLA

337936 Tang, Kok Fai. Novel Grinding Process for Failure Analysis of IC Chip Packaging. Skudai : Universiti Teknologi Malaysia, 2003.