Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| Yazar: | |
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| Materyal Türü: | |
| Dil: | eng |
| Baskı/Yayın Bilgisi: |
Skudai : Universiti Teknologi Malaysia,
2003
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| Konular: |
| _version_ | 1826407610374422528 |
|---|---|
| author | 337936 Tang, Kok Fai |
| author_facet | 337936 Tang, Kok Fai |
| author_sort | 337936 Tang, Kok Fai |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003 |
| first_indexed | 2024-03-05T01:18:40Z |
| format | |
| id | KOHA-OAI-TEST:256424 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T01:18:40Z |
| publishDate | 2003 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2564242020-12-19T17:08:05ZNovel grinding process for failure analysis of IC Chip packaging / 337936 Tang, Kok Fai Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12675 ra20PRZSLDiamond wheelsGrinding and polishing |
| spellingShingle | Diamond wheels Grinding and polishing 337936 Tang, Kok Fai Novel grinding process for failure analysis of IC Chip packaging / |
| title | Novel grinding process for failure analysis of IC Chip packaging / |
| title_full | Novel grinding process for failure analysis of IC Chip packaging / |
| title_fullStr | Novel grinding process for failure analysis of IC Chip packaging / |
| title_full_unstemmed | Novel grinding process for failure analysis of IC Chip packaging / |
| title_short | Novel grinding process for failure analysis of IC Chip packaging / |
| title_sort | novel grinding process for failure analysis of ic chip packaging |
| topic | Diamond wheels Grinding and polishing |
| work_keys_str_mv | AT 337936tangkokfai novelgrindingprocessforfailureanalysisoficchippackaging |