Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Detaylı Bibliyografya
Yazar: 337936 Tang, Kok Fai
Materyal Türü:
Dil:eng
Baskı/Yayın Bilgisi: Skudai : Universiti Teknologi Malaysia, 2003
Konular:
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author 337936 Tang, Kok Fai
author_facet 337936 Tang, Kok Fai
author_sort 337936 Tang, Kok Fai
collection OCEAN
description Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
first_indexed 2024-03-05T01:18:40Z
format
id KOHA-OAI-TEST:256424
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T01:18:40Z
publishDate 2003
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:2564242020-12-19T17:08:05ZNovel grinding process for failure analysis of IC Chip packaging / 337936 Tang, Kok Fai Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12675 ra20PRZSLDiamond wheelsGrinding and polishing
spellingShingle Diamond wheels
Grinding and polishing
337936 Tang, Kok Fai
Novel grinding process for failure analysis of IC Chip packaging /
title Novel grinding process for failure analysis of IC Chip packaging /
title_full Novel grinding process for failure analysis of IC Chip packaging /
title_fullStr Novel grinding process for failure analysis of IC Chip packaging /
title_full_unstemmed Novel grinding process for failure analysis of IC Chip packaging /
title_short Novel grinding process for failure analysis of IC Chip packaging /
title_sort novel grinding process for failure analysis of ic chip packaging
topic Diamond wheels
Grinding and polishing
work_keys_str_mv AT 337936tangkokfai novelgrindingprocessforfailureanalysisoficchippackaging