Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
Үндсэн зохиолч: | |
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Формат: | |
Хэл сонгох: | eng |
Хэвлэсэн: |
Skudai : Universiti Teknologi Malaysia,
2003
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Нөхцлүүд: |
_version_ | 1826407610374422528 |
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author | 337936 Tang, Kok Fai |
author_facet | 337936 Tang, Kok Fai |
author_sort | 337936 Tang, Kok Fai |
collection | OCEAN |
description | Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003 |
first_indexed | 2024-03-05T01:18:40Z |
format | |
id | KOHA-OAI-TEST:256424 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T01:18:40Z |
publishDate | 2003 |
publisher | Skudai : Universiti Teknologi Malaysia, |
record_format | dspace |
spelling | KOHA-OAI-TEST:2564242020-12-19T17:08:05ZNovel grinding process for failure analysis of IC Chip packaging / 337936 Tang, Kok Fai Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12675 ra20PRZSLDiamond wheelsGrinding and polishing |
spellingShingle | Diamond wheels Grinding and polishing 337936 Tang, Kok Fai Novel grinding process for failure analysis of IC Chip packaging / |
title | Novel grinding process for failure analysis of IC Chip packaging / |
title_full | Novel grinding process for failure analysis of IC Chip packaging / |
title_fullStr | Novel grinding process for failure analysis of IC Chip packaging / |
title_full_unstemmed | Novel grinding process for failure analysis of IC Chip packaging / |
title_short | Novel grinding process for failure analysis of IC Chip packaging / |
title_sort | novel grinding process for failure analysis of ic chip packaging |
topic | Diamond wheels Grinding and polishing |
work_keys_str_mv | AT 337936tangkokfai novelgrindingprocessforfailureanalysisoficchippackaging |