Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

ग्रंथसूची विवरण
मुख्य लेखक: 337936 Tang, Kok Fai
स्वरूप:
भाषा:eng
प्रकाशित: Skudai : Universiti Teknologi Malaysia, 2003
विषय:

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