Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
मुख्य लेखक: | 337936 Tang, Kok Fai |
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स्वरूप: | |
भाषा: | eng |
प्रकाशित: |
Skudai : Universiti Teknologi Malaysia,
2003
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विषय: |
समान संसाधन
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