Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| المؤلف الرئيسي: | |
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| التنسيق: | |
| اللغة: | eng |
| منشور في: |
Skudai : Universiti Teknologi Malaysia,
2003
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| الموضوعات: |