Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Podrobná bibliografie
Hlavní autor: 337936 Tang, Kok Fai
Médium:
Jazyk:eng
Vydáno: Skudai : Universiti Teknologi Malaysia, 2003
Témata: