Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Manylion Llyfryddiaeth
Prif Awdur: 337936 Tang, Kok Fai
Fformat:
Iaith:eng
Cyhoeddwyd: Skudai : Universiti Teknologi Malaysia, 2003
Pynciau: