Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| 1. Verfasser: | |
|---|---|
| Format: | |
| Sprache: | eng |
| Veröffentlicht: |
Skudai : Universiti Teknologi Malaysia,
2003
|
| Schlagworte: |