Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Bibliographische Detailangaben
1. Verfasser: 337936 Tang, Kok Fai
Format:
Sprache:eng
Veröffentlicht: Skudai : Universiti Teknologi Malaysia, 2003
Schlagworte: