Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Detalles Bibliográficos
Autor principal: 337936 Tang, Kok Fai
Formato:
Lenguaje:eng
Publicado: Skudai : Universiti Teknologi Malaysia, 2003
Materias: