Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Xehetasun bibliografikoak
Egile nagusia: 337936 Tang, Kok Fai
Formatua:
Hizkuntza:eng
Argitaratua: Skudai : Universiti Teknologi Malaysia, 2003
Gaiak: