Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Sonraí bibleagrafaíochta
Príomhchruthaitheoir: 337936 Tang, Kok Fai
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Teanga:eng
Foilsithe / Cruthaithe: Skudai : Universiti Teknologi Malaysia, 2003
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