Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

書誌詳細
第一著者: 337936 Tang, Kok Fai
フォーマット:
言語:eng
出版事項: Skudai : Universiti Teknologi Malaysia, 2003
主題: