Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| Үндсэн зохиолч: | |
|---|---|
| Формат: | |
| Хэл сонгох: | eng |
| Хэвлэсэн: |
Skudai : Universiti Teknologi Malaysia,
2003
|
| Нөхцлүүд: |