Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Номзүйн дэлгэрэнгүй
Үндсэн зохиолч: 337936 Tang, Kok Fai
Формат:
Хэл сонгох:eng
Хэвлэсэн: Skudai : Universiti Teknologi Malaysia, 2003
Нөхцлүүд: