Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Библиографические подробности
Главный автор: 337936 Tang, Kok Fai
Формат:
Язык:eng
Опубликовано: Skudai : Universiti Teknologi Malaysia, 2003
Предметы: