Novel grinding process for failure analysis of IC Chip packaging /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| Váldodahkki: | |
|---|---|
| Materiálatiipa: | |
| Giella: | eng |
| Almmustuhtton: |
Skudai : Universiti Teknologi Malaysia,
2003
|
| Fáttát: |