Novel grinding process for failure analysis of IC Chip packaging /

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003

Detaylı Bibliyografya
Yazar: 337936 Tang, Kok Fai
Materyal Türü:
Dil:eng
Baskı/Yayın Bilgisi: Skudai : Universiti Teknologi Malaysia, 2003
Konular: