Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
Project Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003
| Autore principale: | |
|---|---|
| Natura: | |
| Lingua: | eng |
| Pubblicazione: |
Skudai : Universiti Teknologi Malaysia,
2003
|
| Soggetti: |
| Riassunto: | Project Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003 |
|---|