Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
Project Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2003
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| Subjects: |
| _version_ | 1826410462655283200 |
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| author | 458460 Wong, Lee Kian |
| author_facet | 458460 Wong, Lee Kian |
| author_sort | 458460 Wong, Lee Kian |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003 |
| first_indexed | 2024-03-05T02:00:29Z |
| format | |
| id | KOHA-OAI-TEST:270343 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T02:00:29Z |
| publishDate | 2003 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2703432020-12-19T17:08:39ZIntermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / 458460 Wong, Lee Kian Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12738 ra22PRZSLSolder and solderingIntermetallic compounds |
| spellingShingle | Solder and soldering Intermetallic compounds 458460 Wong, Lee Kian Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title | Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title_full | Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title_fullStr | Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title_full_unstemmed | Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title_short | Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) / |
| title_sort | intermetallics in lead free solder on direct immersion gold dig under bump metallurgy ubm |
| topic | Solder and soldering Intermetallic compounds |
| work_keys_str_mv | AT 458460wongleekian intermetallicsinleadfreesolderondirectimmersiongolddigunderbumpmetallurgyubm |