Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /

Project Paper (Bachelor of Mechanical Engineering (Materials)) - Universiti Teknologi Malaysia, 2003

Bibliographic Details
Main Author:	458460 Wong, Lee Kian
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2003
Subjects:	Solder and soldering Intermetallic compounds

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