Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages /
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2003
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2003
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| _version_ | 1826410471495827456 |
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| author | 459007 Tan, Cheu Li |
| author_facet | 459007 Tan, Cheu Li |
| author_sort | 459007 Tan, Cheu Li |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2003 |
| first_indexed | 2024-03-05T02:00:37Z |
| format | |
| id | KOHA-OAI-TEST:270387 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T02:00:37Z |
| publishDate | 2003 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2703872020-12-19T17:08:39ZInterdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / 459007 Tan, Cheu Li Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12684 ra22PRZSLSolder and solderingElectronic packaging |
| spellingShingle | Solder and soldering Electronic packaging 459007 Tan, Cheu Li Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title | Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title_full | Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title_fullStr | Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title_full_unstemmed | Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title_short | Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages / |
| title_sort | interdiffusion of tin rich and lead rich composite solder during reflow process and ageing treatment on organic flip chip packages |
| topic | Solder and soldering Electronic packaging |
| work_keys_str_mv | AT 459007tancheuli interdiffusionoftinrichandleadrichcompositesolderduringreflowprocessandageingtreatmentonorganicflipchippackages |