Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /

Thesis (Master of Engineering (Mechanical-Materials)) - Universiti Teknologi Malaysia, 2003

Bibliographic Details
Main Author:	399565 Tai, Siew Fong
Format:
Published:	Skudai : Universiti Teknologi Malaysia, 2003
Subjects:	Solder and soldering
Online Access:	http://www.psz.utm.my/sla/billing/login.asp?mid=42217

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