Thermal simulation of finned metal foam heat sink for electronic cooling application /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2008

Bibliographic Details
Main Authors: 271374 Haslina Abdullah, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal
Format:
Published: 2008
Subjects:
_version_ 1796700669056385024
author 271374 Haslina Abdullah
Nazri Kamsah
Fakulti Kejuruteraan Mekanikal
author_facet 271374 Haslina Abdullah
Nazri Kamsah
Fakulti Kejuruteraan Mekanikal
author_sort 271374 Haslina Abdullah
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2008
first_indexed 2024-03-05T02:03:36Z
format
id KOHA-OAI-TEST:271390
institution Universiti Teknologi Malaysia - OCEAN
last_indexed 2024-03-05T02:03:36Z
publishDate 2008
record_format dspace
spelling KOHA-OAI-TEST:2713902020-12-19T17:08:42ZThermal simulation of finned metal foam heat sink for electronic cooling application / 271374 Haslina Abdullah Nazri Kamsah Fakulti Kejuruteraan Mekanikal 2008Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2008Includes bibliographical referencesFEMELElectronic packagingHeat sinks (Electronics)
spellingShingle Electronic packaging
Heat sinks (Electronics)
271374 Haslina Abdullah
Nazri Kamsah
Fakulti Kejuruteraan Mekanikal
Thermal simulation of finned metal foam heat sink for electronic cooling application /
title Thermal simulation of finned metal foam heat sink for electronic cooling application /
title_full Thermal simulation of finned metal foam heat sink for electronic cooling application /
title_fullStr Thermal simulation of finned metal foam heat sink for electronic cooling application /
title_full_unstemmed Thermal simulation of finned metal foam heat sink for electronic cooling application /
title_short Thermal simulation of finned metal foam heat sink for electronic cooling application /
title_sort thermal simulation of finned metal foam heat sink for electronic cooling application
topic Electronic packaging
Heat sinks (Electronics)
work_keys_str_mv AT 271374haslinaabdullah thermalsimulationoffinnedmetalfoamheatsinkforelectroniccoolingapplication
AT nazrikamsah thermalsimulationoffinnedmetalfoamheatsinkforelectroniccoolingapplication
AT fakultikejuruteraanmekanikal thermalsimulationoffinnedmetalfoamheatsinkforelectroniccoolingapplication