Thermal simulation of finned metal foam heat sink for electronic cooling application /

Thermal simulation of finned metal foam heat sink for electronic cooling application /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2008

Bibliographic Details
Main Authors:	271374 Haslina Abdullah, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal
Format:
Published:	2008
Subjects:	Electronic packaging Heat sinks (Electronics)

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