Quality conformance and qualification of microelectronic packages and interconnects /

Quality conformance and qualification of microelectronic packages and interconnects /

16

Bibliographic Details
Main Author:	Pecht, Michael
Format:
Published:	New York : Wiley-Interscience, 1994
Subjects:	Electronic packaging Quality assurance

Similar Items

Microelectronics interconnection and packaging/
by: Lyman, Jerry
Published: (1980)

Wire bonding in microelectronics /
by: 364840 Harman, George
Published: (2010)

Wire bonding in microelectronics [electronic resource] /
by: 364840 Harman, George
Published: (2010)

Electronic packaging and interconnection handbook /
by: Harper, Charles A.
Published: (2005)

Electronic packaging and interconnection handbook /
by: Harper, Charles A.
Published: (2000)

Journal of electronic packaging [jurnal elektronik]

Polymeric materials for electronics packaging and interconnection /
by: Lupinski, John H., et al.
Published: (1989)

Fundamentals of microsystems packaging /
by: Tummala, Rao R., 1942-
Published: (c200)

Circuits, interconnections, and packaging for VLSI /
by: 171718 Bakoglu, H. B.
Published: (1990)

High performance electronic packaging /
by: International Conference on High Performance Electronic Packaging (1990 : London, UK), et al.
Published: (1991)

Thermal stress and fatigue analysis of microelectronic packaging
by: Tan, Meng Leong.
Published: (2011)

Advanced wirebond interconnection technology /
by: 202777 Prasad, Shankara K.
Published: (2004)

Development of polymeric microelectronics packaging encapsulation for harsh environment applications
by: Phua, Eric Jian Rong
Published: (2018)

Principles of electronic packaging /
by: Seraphim, Donald P., et al.
Published: (1989)

Electronics packaging forum /
by: Morris, James E., 1944-, et al.
Published: (<c19)

Microelectronic packaging /
by: Datta, Madhav, et al.
Published: (2005)

Advanced wirebond interconnection technology [compact disc] /
by: 202777 Prasad, Shankara K.
Published: (2004)

Handbook of electronics packaging design and engineering/
by: 388748 Matisoff, Bernard S.
Published: (1990)

Development in Electronic Packaging – Moving to 3D System Configuration
by: I. Szendiuch
Published: (2011-04-01)

Essentials of electronic packaging : a multidisciplinary approach /
by: Viswanadham, Puligandla
Published: (2011)

Microelectronics packaging handbook/
by: Tummala, Rao R., et al.
Published: (1989)

Area array package design : techniques in high-density electronics /
by: Gilleo, Ken
Published: (2004)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2009)

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore /
by: Zhang, Hengyun, author 648728, et al.
Published: (2019)

Development of polyurethane rubber- modified epoxy resin for microelectronics packaging
by: Bhangale Sunil Madhukar.
Published: (2008)

Novel diamond grinding wheel for fine finishing of IC chip packaging for failure analysis / [nonprojected graphic]

Nanopackaging : nanotechnologies and electronics packaging /
by: Morris, James E., 1944-
Published: (2008)

Power electronic packaging : design, assembly process, reliability and modeling /
by: Liu, Yong.
Published: (2012)

Multichip modules : systems advantages, major constructions, and materials technologies
by: 391896 Johnson, R. Wayne, et al.
Published: (1991)

Top down milling of package substrate for planar delayering /
by: 425768 Lai, Lih Sing
Published: (2002)

Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /
by: Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan), et al.
Published: (2018)

Top down milling of package substrate for planar delayering [microfilm] /
by: 425768 Lai, Lih Sing
Published: (2002)

An Innovative Framework for Quality Assurance in Logistics Packaging
by: Henriett Matyi, et al.
Published: (2023-11-01)

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010 /
by: International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China), et al.
Published: (c201)

Hermeticity of electronic packages /
by: 439657 Greenhouse, Hal
Published: (2000)

Electronic packaging and production [elctronic journal]

Advanced materials for thermal management of electronic packaging /
by: Tong, Xingcun Colin.
Published: (c201)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
by: Ali Ourdjini, author, et al.
Published: (2011)

Study of interfacial reactions between lead-free solders and immersion silver finish [electronic resource] /
by: Safoura Oshaghi, 1977-, et al.
Published: (2008)

Study of interfacial reactions between lead-free solders and immersion silver finish /
by: Safoura Oshaghi, 1977-, et al.
Published: (2008)