Substrate warpage analysis during solder reflow process /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004
| Main Author: | |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2004
|
| Subjects: |
| _version_ | 1826415365985402880 |
|---|---|
| author | 384464 Beh, Keh Shin |
| author_facet | 384464 Beh, Keh Shin |
| author_sort | 384464 Beh, Keh Shin |
| collection | OCEAN |
| description | Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004 |
| first_indexed | 2024-03-05T03:14:20Z |
| format | |
| id | KOHA-OAI-TEST:294977 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T03:14:20Z |
| publishDate | 2004 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2949772020-12-19T17:09:41ZSubstrate warpage analysis during solder reflow process / 384464 Beh, Keh Shin Skudai : Universiti Teknologi Malaysia,2004engThesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004Negative microfilm : MFL 014676 ra16FEMELMicroelectronic packagingRestricted until 16th March 2006 |
| spellingShingle | Microelectronic packaging 384464 Beh, Keh Shin Substrate warpage analysis during solder reflow process / |
| title | Substrate warpage analysis during solder reflow process / |
| title_full | Substrate warpage analysis during solder reflow process / |
| title_fullStr | Substrate warpage analysis during solder reflow process / |
| title_full_unstemmed | Substrate warpage analysis during solder reflow process / |
| title_short | Substrate warpage analysis during solder reflow process / |
| title_sort | substrate warpage analysis during solder reflow process |
| topic | Microelectronic packaging |
| work_keys_str_mv | AT 384464behkehshin substratewarpageanalysisduringsolderreflowprocess |