Substrate warpage analysis during solder reflow process /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004
Autor principal: | 384464 Beh, Keh Shin |
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Formato: | |
Idioma: | eng |
Publicado em: |
Skudai : Universiti Teknologi Malaysia,
2004
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Assuntos: |
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