Substrate warpage analysis during solder reflow process /

Substrate warpage analysis during solder reflow process /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004

Bibliographic Details
Main Author:	384464 Beh, Keh Shin
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2004
Subjects:	Microelectronic packaging

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