Substrate warpage analysis during solder reflow process /

Substrate warpage analysis during solder reflow process /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004

Detalhes bibliográficos
Autor principal:	384464 Beh, Keh Shin
Formato:
Idioma:	eng
Publicado em:	Skudai : Universiti Teknologi Malaysia, 2004
Assuntos:	Microelectronic packaging

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