Substrate warpage analysis during solder reflow process /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004
Main Author: | 384464 Beh, Keh Shin |
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Format: | |
Language: | eng |
Published: |
Skudai : Universiti Teknologi Malaysia,
2004
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Subjects: |
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