Advanced wirebond interconnection technology /
16
| Main Author: | |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
Boston : Kluwer Academic Publishers,
2004
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| Subjects: |
| _version_ | 1796706150750617600 |
|---|---|
| author | 202777 Prasad, Shankara K. |
| author_facet | 202777 Prasad, Shankara K. |
| author_sort | 202777 Prasad, Shankara K. |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-05T03:19:44Z |
| format | |
| id | KOHA-OAI-TEST:296760 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T03:19:44Z |
| publishDate | 2004 |
| publisher | Boston : Kluwer Academic Publishers, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2967602020-12-19T17:09:47ZAdvanced wirebond interconnection technology / 202777 Prasad, Shankara K. Boston : Kluwer Academic Publishers,2004eng16PSZJBLWire bonding (electronic packaging)Wire bonding (electronic packaging)URN:ISBN:1402077629 (hbk.) |
| spellingShingle | Wire bonding (electronic packaging) Wire bonding (electronic packaging) 202777 Prasad, Shankara K. Advanced wirebond interconnection technology / |
| title | Advanced wirebond interconnection technology / |
| title_full | Advanced wirebond interconnection technology / |
| title_fullStr | Advanced wirebond interconnection technology / |
| title_full_unstemmed | Advanced wirebond interconnection technology / |
| title_short | Advanced wirebond interconnection technology / |
| title_sort | advanced wirebond interconnection technology |
| topic | Wire bonding (electronic packaging) Wire bonding (electronic packaging) |
| work_keys_str_mv | AT 202777prasadshankarak advancedwirebondinterconnectiontechnology |