Development of binderless diamond grinding wheel for precision machining of the silicon die and the chip packaging on IC chips for failure analysis /

Development of binderless diamond grinding wheel for precision machining of the silicon die and the chip packaging on IC chips for failure analysis /

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Bibliographic Details
Main Authors: 231335 Venkatesh, V. C. (Vellore Chelvaraj), Izman Sudin, International Conference on Advanced Manufacturing Technology (3rd : 2004 : Kuala Lumpur)
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2004
Subjects:
Grinding machines

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