Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /

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Bibliographic Details
Main Authors: 209274 Liew, Yek Ban, Mohd. Nasir Tamin, Goh, Teck Joo, International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2004
Subjects:
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author 209274 Liew, Yek Ban
Mohd. Nasir Tamin
Goh, Teck Joo
International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)
author_facet 209274 Liew, Yek Ban
Mohd. Nasir Tamin
Goh, Teck Joo
International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)
author_sort 209274 Liew, Yek Ban
collection OCEAN
description 22
first_indexed 2024-03-05T03:50:58Z
format
id KOHA-OAI-TEST:307154
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T03:50:58Z
publishDate 2004
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:3071542020-12-19T17:10:16ZEvolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles / 209274 Liew, Yek Ban Mohd. Nasir Tamin Goh, Teck Joo International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang) Skudai : Universiti Teknologi Malaysia,2004eng22PSZJBLSolder and solderingSolder pastes
spellingShingle Solder and soldering
Solder pastes
209274 Liew, Yek Ban
Mohd. Nasir Tamin
Goh, Teck Joo
International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)
Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title_full Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title_fullStr Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title_full_unstemmed Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title_short Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
title_sort evolution of internal states in a sn pb solder joint during re flow and thermal cycles
topic Solder and soldering
Solder pastes
work_keys_str_mv AT 209274liewyekban evolutionofinternalstatesinasnpbsolderjointduringreflowandthermalcycles
AT mohdnasirtamin evolutionofinternalstatesinasnpbsolderjointduringreflowandthermalcycles
AT gohteckjoo evolutionofinternalstatesinasnpbsolderjointduringreflowandthermalcycles
AT internationalconferenceonelectronicmaterialsandpackagingconference6th2004pulaupinang evolutionofinternalstatesinasnpbsolderjointduringreflowandthermalcycles