Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
22
Main Authors: | 209274 Liew, Yek Ban, Mohd. Nasir Tamin, Goh, Teck Joo, International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang) |
---|---|
Format: | |
Language: | eng |
Published: |
Skudai : Universiti Teknologi Malaysia,
2004
|
Subjects: |
Similar Items
-
Failure analysis of solder joint on fine pitch devices /
by: 266816 Isaac Selvaraj Peter
Published: (1999) -
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
by: 399565 Tai, Siew Fong
Published: (2003) -
Solder paste process control /
by: 438819 Clark, David J. -
Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011) -
Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
by: Koid, Chun Ping, 1987-
Published: (2011)