Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /

Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /

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Bibliographic Details
Main Authors: 209274 Liew, Yek Ban, Mohd. Nasir Tamin, Goh, Teck Joo, International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2004
Subjects:
Solder and soldering
Solder pastes

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