IC component sockets /

IC component sockets /

16

Bibliographic Details
Main Authors:	234506 Liu, Weifeng, Pecht, Michael
Format:
Language:	eng
Published:	Hoboken, N.J. : John Wiley & Sons, 2004
Subjects:	Printed circuits Electric connectors Microelectronic packaging

Similar Items

Smart socket /
by: Aisyah Idris, 1996- , author, et al.
Published: (2018)

Smart socket /
by: Aisyah Idris, 1996- , author
Published: (2018)

Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] /
by: 217123 Ong, You Yang @ Bryan Ong
Published: (2001)

Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements /
by: Cohn, Charles, et al.
Published: (2005)

Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
by: 217123 Ong, You Yang @ Bryan Ong
Published: (2001)

Chip scale package (CSP): design, materials, processes, reliability, and applications /
by: 303750 Lau, John H., et al.
Published: (1998)

Socketing procedures for wire ropes - Resin socketing
by: 5087 International Organization for Standardization

Printed Circuit Boards for Microelectronics /
by: Scarlett, J. A., author 406646
Published: (1970)

Harmonized system of quality assessment for electronic components : sectional specification : two-part and edge socket connectors for printed board application
by: 8096 British Standards Institution, et al.
Published: (1984)

Printed circuit boards for microelectronics /
by: 406646 Scarlett, J. A.
Published: (1980)

Two-pole and earthing-pin plugs, socket-outlets and socket-outlet adaptors
by: 8096 British Standards Institution

Sockets for wire ropes
by: 8096 British Standards Institution

Multi-contact edge socket electrical connectors, single of double sided, close ended with replaceable contacts, through-board solder or wire wrap terminations. Environmental category. Full assessment level
by: 8096 British Standards Institution

Multi-contact edge socket electrical connectors, single or double sided, open ended with metal fixing flanges, guide key location, replaceable contacts and through board solder of wire trap terminations
by: 8096 British Standards Institution

Design requirements for aircraft electrical plug and socket connectors,
by: 5087 International Organization for Standardization

Multi-contact edge socket electrical connector of assessed quality. Single or double sided, open-ended with guide key location replaceable contacts, through board solder or wire wrap terminations - Full assessment level
by: 8096 British Standards Institution

Microelectronics interconnection and packaging/
by: Lyman, Jerry
Published: (1980)

13 amps plugs, switched and unswitched socket-outlets
by: 982 SIRIM

Plugs, socket-outlets and couplers for industrial purposes
by: 8096 British Standards Institution, et al.

Materials for advanced packaging /
by: Lu, Daniel, et al.
Published: (2009)

Polymers in microelectronics : fundamentals and applications/
Published: (1989)

Physical design essentials : an ASIC design implementation perspective /
by: 330575 Golshan, Khosrow
Published: (2007)

Substrate warpage analysis during solder reflow process /
by: 384464 Beh, Keh Shin
Published: (2004)

Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)

Semiconductor packaging : materials interaction and reliability /
by: Chen, Andrea 526875, et al.
Published: (c201)

Microelectronic packaging /
by: Datta, Madhav, et al.
Published: (2005)

Advanced electronic packaging /
by: Brown, William D., 1943-, et al.
Published: (2006)

Introduction to microsystem packaging technology /
by: 517165 Jin, Yufeng, et al.
Published: (c201)

Microelectronics packaging handbook/
by: Tummala, Rao R., et al.
Published: (1989)

Integrated circuits : components of microelectronics/
Published: (1980)

200A flameproof restrained and bolted plugs and sockets for voltages not exceeding 1100V, primarily for use in mining
by: 8096 British Standards Institution

Industrial plugs, socket-outlets and couplers for A.C. and D.C. suppliers
by: 8096 British Standards Institution

Area array packaging processes : for BGA, Flip Chip, and CSP /
by: Gilleo, Ken
Published: (2004)

Mems and microsystems : design, manufacture, and packaging /
by: Hsu, Tai-Ran 332645
Published: (2008)

Introduction to system on package : miniaturization of the entire system /
by: 225994 Tummala, Rao R., et al.
Published: (2008)

MEMS and microsystems : design and manufacture /
by: Hsu, Tai-Ran 332645
Published: (2002)

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
by: 303750 Lau, John H.
Published: (2000)

Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies /
by: 303750 Lau, John H.
Published: (2000)

Fundamentals of microsystems packaging /
by: Tummala, Rao R., 1942-
Published: (c200)

Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
by: Dharmalingam, Sivakumar
Published: (2004)