Study of dissolution nickel layer in enig surface finish during reflow soldering /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Бібліографічні деталі
Автори: 177816 Wong, Mun Hon, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Формат:
Мова:eng
Опубліковано: 2006
Предмети:
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author 177816 Wong, Mun Hon
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
author_facet 177816 Wong, Mun Hon
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
author_sort 177816 Wong, Mun Hon
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
first_indexed 2024-03-04T14:03:09Z
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institution Universiti Teknologi Malaysia - OCEAN
language eng
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publishDate 2006
record_format dspace
spelling KOHA-OAI-TEST:315912020-12-19T16:56:58ZStudy of dissolution nickel layer in enig surface finish during reflow soldering / 177816 Wong, Mun Hon Ali Ourdjini Fakulti Kejuruteraan Mekanikal 2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006Includes bibliographical referencesFEMELNickelSolder and soldering
spellingShingle Nickel
Solder and soldering
177816 Wong, Mun Hon
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
Study of dissolution nickel layer in enig surface finish during reflow soldering /
title Study of dissolution nickel layer in enig surface finish during reflow soldering /
title_full Study of dissolution nickel layer in enig surface finish during reflow soldering /
title_fullStr Study of dissolution nickel layer in enig surface finish during reflow soldering /
title_full_unstemmed Study of dissolution nickel layer in enig surface finish during reflow soldering /
title_short Study of dissolution nickel layer in enig surface finish during reflow soldering /
title_sort study of dissolution nickel layer in enig surface finish during reflow soldering
topic Nickel
Solder and soldering
work_keys_str_mv AT 177816wongmunhon studyofdissolutionnickellayerinenigsurfacefinishduringreflowsoldering
AT aliourdjini studyofdissolutionnickellayerinenigsurfacefinishduringreflowsoldering
AT fakultikejuruteraanmekanikal studyofdissolutionnickellayerinenigsurfacefinishduringreflowsoldering