Study of dissolution nickel layer in enig surface finish during reflow soldering /

Study of dissolution nickel layer in enig surface finish during reflow soldering /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Authors:	177816 Wong, Mun Hon, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2006
Subjects:	Nickel Solder and soldering

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