Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004

Dades bibliogràfiques
Autor principal: 396114 Nordiana Najib
Format:
Idioma:eng
Publicat: Skudai : Universiti Teknologi Malaysia, 2004
Matèries:
Electronic packaging
Intermetallic compounds
Solder and soldering
Descripció
Sumari:Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004

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