Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2004
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| Subjects: |
| _version_ | 1826420676441931776 |
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| author | 396114 Nordiana Najib |
| author_facet | 396114 Nordiana Najib |
| author_sort | 396114 Nordiana Najib |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004 |
| first_indexed | 2024-03-05T04:34:38Z |
| format | |
| id | KOHA-OAI-TEST:321692 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T04:34:38Z |
| publishDate | 2004 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3216922020-12-19T17:10:51ZIntermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / 396114 Nordiana Najib Skudai : Universiti Teknologi Malaysia,2004engProject Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004Negative mikrofilm : MFL 13193 ra16FEMELElectronic packagingIntermetallic compoundsSolder and soldering |
| spellingShingle | Electronic packaging Intermetallic compounds Solder and soldering 396114 Nordiana Najib Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title | Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title_full | Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title_fullStr | Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title_full_unstemmed | Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title_short | Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) / |
| title_sort | intermetallic formation between lead based solder and cu ni au under bump metallurgy ubm |
| topic | Electronic packaging Intermetallic compounds Solder and soldering |
| work_keys_str_mv | AT 396114nordiananajib intermetallicformationbetweenleadbasedsolderandcuniauunderbumpmetallurgyubm |