Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2004

Bibliographic Details
Main Author:	396114 Nordiana Najib
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2004
Subjects:	Electronic packaging Intermetallic compounds Solder and soldering

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