Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia

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Bibliographic Details
Main Authors: International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang), Zaidi Mohd. Ripin, K. N. Seetharamu, Mohd. Zulkifly Abdullah, Universiti Sains Malaysia. School of Mechanical Engineering
Format:
Language:eng
Published: Penang, Malaysia : IEEE CPMT, 2004
Subjects:
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author International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang)
Zaidi Mohd. Ripin
K. N. Seetharamu
Mohd. Zulkifly Abdullah
Universiti Sains Malaysia. School of Mechanical Engineering
author_facet International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang)
Zaidi Mohd. Ripin
K. N. Seetharamu
Mohd. Zulkifly Abdullah
Universiti Sains Malaysia. School of Mechanical Engineering
author_sort International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang)
collection OCEAN
description 15
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institution Universiti Teknologi Malaysia - OCEAN
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publishDate 2004
publisher Penang, Malaysia : IEEE CPMT,
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spelling KOHA-OAI-TEST:3247512020-12-19T17:10:58ZProceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang) Zaidi Mohd. Ripin K. N. Seetharamu Mohd. Zulkifly Abdullah Universiti Sains Malaysia. School of Mechanical Engineering Penang, Malaysia : IEEE CPMT,2004eng15PSZJBLElectronic apparatus and appliancesURN:ISBN:983251486X (pbk.)
spellingShingle Electronic apparatus and appliances
International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang)
Zaidi Mohd. Ripin
K. N. Seetharamu
Mohd. Zulkifly Abdullah
Universiti Sains Malaysia. School of Mechanical Engineering
Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title_full Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title_fullStr Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title_full_unstemmed Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title_short Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia
title_sort proceedings of international conference electronic materials and packaging emap 2004 5th 7th december 2004 universiti sains malaysia penang malaysia
topic Electronic apparatus and appliances
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