Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia

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Bibliographic Details
Main Authors: International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang), Zaidi Mohd. Ripin, K. N. Seetharamu, Mohd. Zulkifly Abdullah, Universiti Sains Malaysia. School of Mechanical Engineering
Format:
Language:eng
Published: Penang, Malaysia : IEEE CPMT, 2004
Subjects:

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