Multichip modules : systems advantages, major constructions, and materials technologies
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| Main Authors: | , , |
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New York : IEEE,
1991
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| _version_ | 1796715544064294912 |
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| author | 391896 Johnson, R. Wayne Balde, John W. Teng, Robert K. F. |
| author_facet | 391896 Johnson, R. Wayne Balde, John W. Teng, Robert K. F. |
| author_sort | 391896 Johnson, R. Wayne |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-05T05:36:41Z |
| format | |
| id | KOHA-OAI-TEST:342352 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-05T05:36:41Z |
| publishDate | 1991 |
| publisher | New York : IEEE, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3423522020-12-19T17:11:38ZMultichip modules : systems advantages, major constructions, and materials technologies 391896 Johnson, R. Wayne Balde, John W. Teng, Robert K. F. New York : IEEE,199116PSZJBLElectronic packagingMicroelectronic packagingURN:ISBN:087942267X |
| spellingShingle | Electronic packaging Microelectronic packaging 391896 Johnson, R. Wayne Balde, John W. Teng, Robert K. F. Multichip modules : systems advantages, major constructions, and materials technologies |
| title | Multichip modules : systems advantages, major constructions, and materials technologies |
| title_full | Multichip modules : systems advantages, major constructions, and materials technologies |
| title_fullStr | Multichip modules : systems advantages, major constructions, and materials technologies |
| title_full_unstemmed | Multichip modules : systems advantages, major constructions, and materials technologies |
| title_short | Multichip modules : systems advantages, major constructions, and materials technologies |
| title_sort | multichip modules systems advantages major constructions and materials technologies |
| topic | Electronic packaging Microelectronic packaging |
| work_keys_str_mv | AT 391896johnsonrwayne multichipmodulessystemsadvantagesmajorconstructionsandmaterialstechnologies AT baldejohnw multichipmodulessystemsadvantagesmajorconstructionsandmaterialstechnologies AT tengrobertkf multichipmodulessystemsadvantagesmajorconstructionsandmaterialstechnologies |