Mechanism-based reliabilty model for electronic packages /

Mechanism-based reliabilty model for electronic packages /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author: 445879 Ng, Chee Weng
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2005
Subjects:
Reliability (Engineering)
Online Access:http://www.psz.utm.my/sla/billing/login.asp?mid=42939
Description
Summary:Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2005

Similar Items