The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2005
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| Online Access: | http://www.psz.utm.my/sla/billing/login.asp?mid=54800 |
| _version_ | 1826431422582226944 |
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| author | 200265 Moey, Chin Boon |
| author_facet | 200265 Moey, Chin Boon |
| author_sort | 200265 Moey, Chin Boon |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T07:15:29Z |
| format | |
| id | KOHA-OAI-TEST:375229 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T07:15:29Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3752292020-12-19T17:13:04ZThe effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / 200265 Moey, Chin Boon Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005Negative microfilm : MFL 13767 ra22FEMELSolder and solderingIntermetallic compoundshttp://www.psz.utm.my/sla/billing/login.asp?mid=54800 |
| spellingShingle | Solder and soldering Intermetallic compounds 200265 Moey, Chin Boon The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title_full | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title_fullStr | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title_full_unstemmed | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title_short | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish / |
| title_sort | effects of heat treatment on the formation of intermetallics formation of solder joints between sn ag cu and eutectic pb sn solders and electroless nickel immersion gold surface finish |
| topic | Solder and soldering Intermetallic compounds |
| url | http://www.psz.utm.my/sla/billing/login.asp?mid=54800 |
| work_keys_str_mv | AT 200265moeychinboon theeffectsofheattreatmentontheformationofintermetallicsformationofsolderjointsbetweensnagcuandeutecticpbsnsoldersandelectrolessnickelimmersiongoldsurfacefinish AT 200265moeychinboon effectsofheattreatmentontheformationofintermetallicsformationofsolderjointsbetweensnagcuandeutecticpbsnsoldersandelectrolessnickelimmersiongoldsurfacefinish |