Characteristics of stress and strain field in organic substrate of a flip chip /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2005
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| _version_ | 1826431869525164032 |
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| author | 295860 Chong, Wan Guan |
| author_facet | 295860 Chong, Wan Guan |
| author_sort | 295860 Chong, Wan Guan |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T07:22:14Z |
| format | |
| id | KOHA-OAI-TEST:377488 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T07:22:14Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3774882020-12-19T17:13:09ZCharacteristics of stress and strain field in organic substrate of a flip chip / 295860 Chong, Wan Guan Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005Negative microfilm : MFL 13314 ra16FEMELMultichip modules (Microelectronics) |
| spellingShingle | Multichip modules (Microelectronics) 295860 Chong, Wan Guan Characteristics of stress and strain field in organic substrate of a flip chip / |
| title | Characteristics of stress and strain field in organic substrate of a flip chip / |
| title_full | Characteristics of stress and strain field in organic substrate of a flip chip / |
| title_fullStr | Characteristics of stress and strain field in organic substrate of a flip chip / |
| title_full_unstemmed | Characteristics of stress and strain field in organic substrate of a flip chip / |
| title_short | Characteristics of stress and strain field in organic substrate of a flip chip / |
| title_sort | characteristics of stress and strain field in organic substrate of a flip chip |
| topic | Multichip modules (Microelectronics) |
| work_keys_str_mv | AT 295860chongwanguan characteristicsofstressandstrainfieldinorganicsubstrateofaflipchip |