Characteristics of stress and strain field in organic substrate of a flip chip /

Characteristics of stress and strain field in organic substrate of a flip chip /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005

Detalhes bibliográficos
Autor principal:	295860 Chong, Wan Guan
Formato:
Idioma:	eng
Publicado em:	Skudai : Universiti Teknologi Malaysia, 2005
Assuntos:	Multichip modules (Microelectronics)

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