Effect of flux type on intermetallics formation in solder joint /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005
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Format: | |
Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2005
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Online Access: | http://www.psz.utm.my/sla/billing/login.asp?mid=54506 |
_version_ | 1796722874916012032 |
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author | 296018 Cheong, Jeng Seng |
author_facet | 296018 Cheong, Jeng Seng |
author_sort | 296018 Cheong, Jeng Seng |
collection | OCEAN |
description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005 |
first_indexed | 2024-03-05T07:22:28Z |
format | |
id | KOHA-OAI-TEST:377565 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T07:22:28Z |
publishDate | 2005 |
publisher | Skudai : Universiti Teknologi Malaysia, |
record_format | dspace |
spelling | KOHA-OAI-TEST:3775652020-12-19T17:13:09ZEffect of flux type on intermetallics formation in solder joint / 296018 Cheong, Jeng Seng Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005Negative microfilm : MFL 13325 ra22FEMELSolder and solderingIntermetallic compoundshttp://www.psz.utm.my/sla/billing/login.asp?mid=54506 |
spellingShingle | Solder and soldering Intermetallic compounds 296018 Cheong, Jeng Seng Effect of flux type on intermetallics formation in solder joint / |
title | Effect of flux type on intermetallics formation in solder joint / |
title_full | Effect of flux type on intermetallics formation in solder joint / |
title_fullStr | Effect of flux type on intermetallics formation in solder joint / |
title_full_unstemmed | Effect of flux type on intermetallics formation in solder joint / |
title_short | Effect of flux type on intermetallics formation in solder joint / |
title_sort | effect of flux type on intermetallics formation in solder joint |
topic | Solder and soldering Intermetallic compounds |
url | http://www.psz.utm.my/sla/billing/login.asp?mid=54506 |
work_keys_str_mv | AT 296018cheongjengseng effectoffluxtypeonintermetallicsformationinsolderjoint |