Effect of flux type on intermetallics formation in solder joint /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author: 296018 Cheong, Jeng Seng
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2005
Subjects:
Online Access:http://www.psz.utm.my/sla/billing/login.asp?mid=54506
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author 296018 Cheong, Jeng Seng
author_facet 296018 Cheong, Jeng Seng
author_sort 296018 Cheong, Jeng Seng
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005
first_indexed 2024-03-05T07:22:28Z
format
id KOHA-OAI-TEST:377565
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T07:22:28Z
publishDate 2005
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:3775652020-12-19T17:13:09ZEffect of flux type on intermetallics formation in solder joint / 296018 Cheong, Jeng Seng Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005Negative microfilm : MFL 13325 ra22FEMELSolder and solderingIntermetallic compoundshttp://www.psz.utm.my/sla/billing/login.asp?mid=54506
spellingShingle Solder and soldering
Intermetallic compounds
296018 Cheong, Jeng Seng
Effect of flux type on intermetallics formation in solder joint /
title Effect of flux type on intermetallics formation in solder joint /
title_full Effect of flux type on intermetallics formation in solder joint /
title_fullStr Effect of flux type on intermetallics formation in solder joint /
title_full_unstemmed Effect of flux type on intermetallics formation in solder joint /
title_short Effect of flux type on intermetallics formation in solder joint /
title_sort effect of flux type on intermetallics formation in solder joint
topic Solder and soldering
Intermetallic compounds
url http://www.psz.utm.my/sla/billing/login.asp?mid=54506
work_keys_str_mv AT 296018cheongjengseng effectoffluxtypeonintermetallicsformationinsolderjoint