Electronics packaging forum /
Includes bibliographical references and index.
Hlavní autoři: | , |
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Médium: | |
Jazyk: | eng |
Vydáno: |
New York : Van Nostrand Reinhold,
<c19
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Témata: |
_version_ | 1826433291961499648 |
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author | Morris, James E., 1944- State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division |
author_facet | Morris, James E., 1944- State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division |
author_sort | Morris, James E., 1944- |
collection | OCEAN |
description | Includes bibliographical references and index. |
first_indexed | 2024-03-05T07:43:44Z |
format | |
id | KOHA-OAI-TEST:384624 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T07:43:44Z |
publishDate | <c19 |
publisher | New York : Van Nostrand Reinhold, |
record_format | dspace |
spelling | KOHA-OAI-TEST:3846242020-12-19T17:13:25ZElectronics packaging forum / Morris, James E., 1944- State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division New York : Van Nostrand Reinhold,<c1991- >engIncludes bibliographical references and index.16PSZKLLElectronic packagingURN:ISBN:0442001789 (v.1)URN:ISBN:0442004761 (v.2) |
spellingShingle | Electronic packaging Morris, James E., 1944- State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division Electronics packaging forum / |
title | Electronics packaging forum / |
title_full | Electronics packaging forum / |
title_fullStr | Electronics packaging forum / |
title_full_unstemmed | Electronics packaging forum / |
title_short | Electronics packaging forum / |
title_sort | electronics packaging forum |
topic | Electronic packaging |
work_keys_str_mv | AT morrisjamese1944 electronicspackagingforum AT stateuniversityofnewyorkatbinghamtontjwatsonschoolofengineeringappliedscienceandtechnologycontinuingeducationdivision electronicspackagingforum |