Adhesives technology for electronic applications : materials, processes, reliability /
16
| Main Authors: | , |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
Norwich, NY : William Andrew Pub.,
2005
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| Subjects: |
| _version_ | 1796724799277367296 |
|---|---|
| author | Licari, James J., 1930- Swanson, Dale W. |
| author_facet | Licari, James J., 1930- Swanson, Dale W. |
| author_sort | Licari, James J., 1930- |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-05T07:49:44Z |
| format | |
| id | KOHA-OAI-TEST:386628 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T07:49:44Z |
| publishDate | 2005 |
| publisher | Norwich, NY : William Andrew Pub., |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3866282020-12-19T17:13:29ZAdhesives technology for electronic applications : materials, processes, reliability / Licari, James J., 1930- Swanson, Dale W. Norwich, NY : William Andrew Pub.,2005eng16PSZJBLElectronicsAdhesivesElectronic packagingURN:ISBN:0815515138 (hbk.) |
| spellingShingle | Electronics Adhesives Electronic packaging Licari, James J., 1930- Swanson, Dale W. Adhesives technology for electronic applications : materials, processes, reliability / |
| title | Adhesives technology for electronic applications : materials, processes, reliability / |
| title_full | Adhesives technology for electronic applications : materials, processes, reliability / |
| title_fullStr | Adhesives technology for electronic applications : materials, processes, reliability / |
| title_full_unstemmed | Adhesives technology for electronic applications : materials, processes, reliability / |
| title_short | Adhesives technology for electronic applications : materials, processes, reliability / |
| title_sort | adhesives technology for electronic applications materials processes reliability |
| topic | Electronics Adhesives Electronic packaging |
| work_keys_str_mv | AT licarijamesj1930 adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability AT swansondalew adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability |