Electronics packaging forum : multichip module technology issues /

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Bibliographic Details
Main Author: Morris, James E., 1944-
Format:
Published: New York : IEEE, 1994
Subjects:
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author Morris, James E., 1944-
author_facet Morris, James E., 1944-
author_sort Morris, James E., 1944-
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description 16
first_indexed 2024-03-05T07:53:54Z
format
id KOHA-OAI-TEST:388025
institution Universiti Teknologi Malaysia - OCEAN
last_indexed 2024-03-05T07:53:54Z
publishDate 1994
publisher New York : IEEE,
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spelling KOHA-OAI-TEST:3880252020-12-19T17:13:32ZElectronics packaging forum : multichip module technology issues / Morris, James E., 1944- New York : IEEE,199416PSZKLLElectronic packagingMultichip modules (Microelectronics)URN:ISBN:078030439X
spellingShingle Electronic packaging
Multichip modules (Microelectronics)
Morris, James E., 1944-
Electronics packaging forum : multichip module technology issues /
title Electronics packaging forum : multichip module technology issues /
title_full Electronics packaging forum : multichip module technology issues /
title_fullStr Electronics packaging forum : multichip module technology issues /
title_full_unstemmed Electronics packaging forum : multichip module technology issues /
title_short Electronics packaging forum : multichip module technology issues /
title_sort electronics packaging forum multichip module technology issues
topic Electronic packaging
Multichip modules (Microelectronics)
work_keys_str_mv AT morrisjamese1944 electronicspackagingforummultichipmoduletechnologyissues