Electronics packaging forum : multichip module technology issues /
16
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Format: | |
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New York : IEEE,
1994
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Subjects: |
_version_ | 1826433980358983680 |
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author | Morris, James E., 1944- |
author_facet | Morris, James E., 1944- |
author_sort | Morris, James E., 1944- |
collection | OCEAN |
description | 16 |
first_indexed | 2024-03-05T07:53:54Z |
format | |
id | KOHA-OAI-TEST:388025 |
institution | Universiti Teknologi Malaysia - OCEAN |
last_indexed | 2024-03-05T07:53:54Z |
publishDate | 1994 |
publisher | New York : IEEE, |
record_format | dspace |
spelling | KOHA-OAI-TEST:3880252020-12-19T17:13:32ZElectronics packaging forum : multichip module technology issues / Morris, James E., 1944- New York : IEEE,199416PSZKLLElectronic packagingMultichip modules (Microelectronics)URN:ISBN:078030439X |
spellingShingle | Electronic packaging Multichip modules (Microelectronics) Morris, James E., 1944- Electronics packaging forum : multichip module technology issues / |
title | Electronics packaging forum : multichip module technology issues / |
title_full | Electronics packaging forum : multichip module technology issues / |
title_fullStr | Electronics packaging forum : multichip module technology issues / |
title_full_unstemmed | Electronics packaging forum : multichip module technology issues / |
title_short | Electronics packaging forum : multichip module technology issues / |
title_sort | electronics packaging forum multichip module technology issues |
topic | Electronic packaging Multichip modules (Microelectronics) |
work_keys_str_mv | AT morrisjamese1944 electronicspackagingforummultichipmoduletechnologyissues |