Electronics packaging forum : multichip module technology issues /
16
Autor principal: | Morris, James E., 1944- |
---|---|
Formato: | |
Publicado em: |
New York : IEEE,
1994
|
Assuntos: |
Registros relacionados
-
Multichip module design, fabrication, and testing /
por: 463530 Licari, James J.
Publicado em: (1995) -
Multichip modules and related technologies : MCM, TAB and COB Design /
por: 416933 Ginsberg, Gerald L., et al.
Publicado em: (1994) -
Introduction to system on package : miniaturization of the entire system /
por: 225994 Tummala, Rao R., et al.
Publicado em: (2008) -
Area array packaging processes : for BGA, Flip Chip, and CSP /
por: Gilleo, Ken
Publicado em: (2004) -
Multichip modules with integrated sensors /
por: Jones, W. Kinzy, et al.
Publicado em: (1996)