Electronics packaging forum : multichip module technology issues /

Electronics packaging forum : multichip module technology issues /

16

Bibliographic Details
Main Author:	Morris, James E., 1944-
Format:
Published:	New York : IEEE, 1994
Subjects:	Electronic packaging Multichip modules (Microelectronics)

Similar Items

Multichip module design, fabrication, and testing /
by: 463530 Licari, James J.
Published: (1995)

Multichip modules and related technologies : MCM, TAB and COB Design /
by: 416933 Ginsberg, Gerald L., et al.
Published: (1994)

Introduction to system on package : miniaturization of the entire system /
by: 225994 Tummala, Rao R., et al.
Published: (2008)

Area array packaging processes : for BGA, Flip Chip, and CSP /
by: Gilleo, Ken
Published: (2004)

Multichip modules with integrated sensors /
by: Jones, W. Kinzy, et al.
Published: (1996)

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
by: 303750 Lau, John H.
Published: (2000)

Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies /
by: 303750 Lau, John H.
Published: (2000)

Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] /
by: 295860 Chong, Wan Guan
Published: (2005)

Characteristics of stress and strain field in organic substrate of a flip chip /
by: 295860 Chong, Wan Guan
Published: (2005)

Multichip modules : systems advantages, major constructions, and materials technologies
by: 391896 Johnson, R. Wayne, et al.
Published: (1991)

System-in-package RF design and applications /
by: 452860 Gaynor, Michael P.
Published: (2007)

Electronics packaging forum /
by: Morris, James E., 1944-, et al.
Published: (<c19)

Chip on board technologies for multichip modules /
by: Lau, Sien Ting
Published: (1994)

Routing in the third dimension : from VLSI chips to MCMs /
by: 290513 Sherwani, Naveed A., et al.
Published: (1995)

High performance electronic packaging /
by: International Conference on High Performance Electronic Packaging (1990 : London, UK), et al.
Published: (1991)

Advanced electronic packaging /
by: Brown, William D., 1943-, et al.
Published: (2006)

Introduction to microsystem packaging technology /
by: 517165 Jin, Yufeng, et al.
Published: (c201)

Fundamentals of microsystems packaging /
by: Tummala, Rao R., 1942-
Published: (c200)

Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)

Materials for advanced packaging /
by: Lu, Daniel, et al.
Published: (2009)

Microelectronic packaging /
by: Datta, Madhav, et al.
Published: (2005)

Microelectronics packaging handbook/
by: Tummala, Rao R., et al.
Published: (1989)

Reliability of electronic packages and semiconductor devices /
by: 323212 Di Giacomo, Giulio
Published: (1997)

Semiconductor packaging : materials interaction and reliability /
by: Chen, Andrea 526875, et al.
Published: (c201)

Nanopackaging : nanotechnologies and electronics packaging /
by: Morris, James E., 1944-
Published: (2008)

Mems and microsystems : design, manufacture, and packaging /
by: Hsu, Tai-Ran 332645
Published: (2008)

Microelectronics interconnection and packaging/
by: Lyman, Jerry
Published: (1980)

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010 /
by: International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China), et al.
Published: (c201)

Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination /
by: 217123 Ong, You Yang @ Bryan Ong
Published: (2001)

Mems packaging /
by: Hsu, Tai-Ran
Published: (2004)

Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] /
by: 217123 Ong, You Yang @ Bryan Ong
Published: (2001)

Chip scale package (CSP): design, materials, processes, reliability, and applications /
by: 303750 Lau, John H., et al.
Published: (1998)

Design of a virtual laboratory module for teaching electronic pyhsics using labview /
by: 215122 Ida Ilyana Mohd. Zahidi, et al.
Published: (2005)

Optoelectronic packaging /
by: Mickelson, Alan Rolf, 1950-, et al.
Published: (1997)

Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements /
by: Cohn, Charles, et al.
Published: (2005)

Substrate warpage analysis during solder reflow process /
by: 384464 Beh, Keh Shin
Published: (2004)

Journal of electronic packaging [jurnal elektronik]

LCP for microwave packages and modules /
by: Pham, Anh-Vu H., et al.
Published: (2012)

Area array packaging handbook /
by: 193092 Gilleo, Ken
Published: (2002)

Electrostatic sensor design and sensor characteristic study for electrostatic charge measurement [electronic resource] /
by: Mohd. Riduwan Ghazali, 1984-
Published: (2010)