Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2006
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| Taal: | eng |
| Gepubliceerd in: |
Skudai : Universiti Teknologi Malaysia,
2006
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| Samenvatting: | Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2006 |
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